Vulnerabilities > Qualcomm > Qcn9074 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-11-07 | CVE-2023-28563 | Unspecified vulnerability in Qualcomm products Information disclosure in IOE Firmware while handling WMI command. | 5.5 |
| 2023-11-07 | CVE-2023-28569 | Unspecified vulnerability in Qualcomm products Information disclosure in WLAN HAL while handling command through WMI interfaces. | 5.5 |
| 2023-11-07 | CVE-2023-28570 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while processing audio effects. | 7.8 |
| 2023-11-07 | CVE-2023-33031 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Automotive Audio while copying data from ADSP shared buffer to the VOC packet data buffer. | 7.8 |
| 2023-11-07 | CVE-2023-33045 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN Firmware while parsing a NAN management frame carrying a S3 attribute. | 9.8 |
| 2023-11-07 | CVE-2023-33047 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing no-inherit IES. | 7.5 |
| 2023-11-07 | CVE-2023-33048 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing t2lm buffers. | 7.5 |
| 2023-11-07 | CVE-2023-33056 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS in WLAN Firmware when firmware receives beacon including T2LM IE. | 7.5 |
| 2023-11-07 | CVE-2023-33059 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio while processing the VOC packet data from ADSP. | 7.8 |
| 2023-11-07 | CVE-2023-33061 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing WLAN beacon or probe-response frame. | 7.5 |