Vulnerabilities > Qualcomm > Qcn9074 Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2024-08-05 | CVE-2024-21459 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while handling beacon or probe response frame in STA. | 7.5 |
2024-08-05 | CVE-2024-21467 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while handling beacon probe frame during scan entry generation in client side. | 7.5 |
2024-08-05 | CVE-2024-33027 | Unspecified vulnerability in Qualcomm products Memory corruption can occur when arbitrary user-space app gains kernel level privilege to modify DDR memory by corrupting the GPU page table. | 7.8 |
2024-07-01 | CVE-2024-21457 | Out-of-bounds Read vulnerability in Qualcomm products INformation disclosure while handling Multi-link IE in beacon frame. | 7.5 |
2024-07-01 | CVE-2024-21458 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while handling SA query action frame. | 7.5 |
2024-07-01 | CVE-2024-21461 | Double Free vulnerability in Qualcomm products Memory corruption while performing finish HMAC operation when context is freed by keymaster. | 7.8 |
2024-07-01 | CVE-2024-21462 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while loading the TA ELF file. | 5.5 |
2024-07-01 | CVE-2024-21466 | Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products Information disclosure while parsing sub-IE length during new IE generation. | 7.5 |
2024-07-01 | CVE-2024-21482 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption during the secure boot process, when the `bootm` command is used, it bypasses the authentication of the kernel/rootfs image. | 7.8 |
2024-06-03 | CVE-2023-43537 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while handling T2LM Action Frame in WLAN Host. | 7.5 |