Vulnerabilities > Qualcomm > Qcn9074 Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-08-08 | CVE-2023-28576 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products The buffer obtained from kernel APIs such as cam_mem_get_cpu_buf() may be readable/writable in userspace after kernel accesses it. | 7.0 |
2023-08-08 | CVE-2023-28577 | Use After Free vulnerability in Qualcomm products In the function call related to CAM_REQ_MGR_RELEASE_BUF there is no check if the buffer is being used. | 7.8 |
2023-07-04 | CVE-2023-22386 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in WLAN HOST while processing WLAN FW request to allocate memory. | 7.8 |
2023-07-04 | CVE-2023-22387 | Unspecified vulnerability in Qualcomm products Arbitrary memory overwrite when VM gets compromised in TX write leading to Memory Corruption. | 7.8 |
2023-07-04 | CVE-2023-22667 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory Corruption in Audio while allocating the ion buffer during the music playback. | 7.8 |
2023-07-04 | CVE-2023-24851 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in WLAN HOST while parsing QMI response message from firmware. | 7.8 |
2023-07-04 | CVE-2023-28541 | Out-of-bounds Read vulnerability in Qualcomm products Memory Corruption in Data Modem while processing DMA buffer release event about CFR data. | 7.8 |
2023-07-04 | CVE-2023-28542 | Out-of-bounds Read vulnerability in Qualcomm products Memory Corruption in WLAN HOST while fetching TX status information. | 7.8 |
2023-06-06 | CVE-2022-22076 | Unspecified vulnerability in Qualcomm products information disclosure due to cryptographic issue in Core during RPMB read request. | 5.5 |
2023-06-06 | CVE-2022-40507 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in Core while mapping HLOS address to the list. | 7.8 |