Vulnerabilities > Qualcomm > Qcn9072 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-01-02 | CVE-2023-33062 | Unspecified vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing a BTM request. | 7.5 |
| 2024-01-02 | CVE-2023-33109 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS while processing a WMI P2P listen start command (0xD00A) sent from host. | 7.5 |
| 2024-01-02 | CVE-2023-33116 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing ieee80211_parse_mscs_ie in WIN WLAN driver. | 7.5 |
| 2024-01-02 | CVE-2023-43511 | Infinite Loop vulnerability in Qualcomm products Transient DOS while parsing IPv6 extension header when WLAN firmware receives an IPv6 packet that contains `IPPROTO_NONE` as the next header. | 7.5 |
| 2023-12-05 | CVE-2023-28550 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in MPP performance while accessing DSM watermark using external memory address. | 7.8 |
| 2023-12-05 | CVE-2023-28585 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption while loading an ELF segment in TEE Kernel. | 8.8 |
| 2023-12-05 | CVE-2023-33041 | Reachable Assertion vulnerability in Qualcomm products Under certain scenarios the WLAN Firmware will reach an assertion due to state confusion while looking up peer ids. | 7.5 |
| 2023-12-05 | CVE-2023-33053 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption in Kernel while parsing metadata. | 7.8 |
| 2023-12-05 | CVE-2023-33063 | Use After Free vulnerability in Qualcomm products Memory corruption in DSP Services during a remote call from HLOS to DSP. | 7.8 |
| 2023-12-05 | CVE-2023-33080 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame. | 7.5 |