Vulnerabilities > Qualcomm > Qcn9024 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2025-02-03 | CVE-2024-45571 | Use After Free vulnerability in Qualcomm products Memory corruption may occour occur when stopping the WLAN interface after processing a WMI command from the interface. | 7.8 |
| 2025-02-03 | CVE-2024-49838 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while parsing the OCI IE with invalid length. | 7.5 |
| 2025-01-06 | CVE-2024-45558 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS can occur when the driver parses the per STA profile IE and tries to access the EXTN element ID without checking the IE length. | 7.5 |
| 2024-12-02 | CVE-2024-33063 | Integer Overflow or Wraparound vulnerability in Qualcomm products Transient DOS while parsing the ML IE when a beacon with common info length of the ML IE greater than the ML IE inside which this element is present. | 7.5 |
| 2024-11-04 | CVE-2024-38415 | Use After Free vulnerability in Qualcomm products Memory corruption while handling session errors from firmware. | 7.8 |
| 2024-11-04 | CVE-2024-38423 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption while processing GPU page table switch. | 7.8 |
| 2024-10-07 | CVE-2024-33049 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing noninheritance IE of Extension element when length of IE is 2 of beacon frame. | 7.5 |
| 2024-10-07 | CVE-2024-33073 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while parsing the BSS parameter change count or MLD capabilities fields of the ML IE. | 8.2 |
| 2024-10-07 | CVE-2024-38397 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing probe response and assoc response frame. | 7.5 |
| 2024-09-02 | CVE-2024-33045 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when BTFM client sends new messages over Slimbus to ADSP. | 7.8 |