Vulnerabilities > Qualcomm > Qcn7606 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-07-04 | CVE-2023-28541 | Out-of-bounds Read vulnerability in Qualcomm products Memory Corruption in Data Modem while processing DMA buffer release event about CFR data. | 7.8 |
| 2023-06-06 | CVE-2022-40507 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in Core while mapping HLOS address to the list. | 7.8 |
| 2023-06-06 | CVE-2023-21628 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while processing WMI-UTF command or FTM TLV1 command. | 7.8 |
| 2023-04-13 | CVE-2022-33231 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in core while initializing the encryption key. | 7.8 |
| 2023-04-13 | CVE-2022-40503 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure due to buffer over-read in Bluetooth Host while A2DP streaming. | 7.5 |
| 2023-04-13 | CVE-2022-40532 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption due to integer overflow or wraparound in WLAN while sending WMI cmd from host to target. | 7.8 |
| 2023-03-10 | CVE-2022-33245 | Use After Free vulnerability in Qualcomm products Memory corruption in WLAN due to use after free | 7.8 |
| 2023-03-10 | CVE-2022-33257 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption in Core due to time-of-check time-of-use race condition during dump collection in trust zone. | 7.0 |
| 2023-03-10 | CVE-2022-33278 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption due to buffer copy without checking the size of input in HLOS when input message size is larger than the buffer capacity. | 7.8 |
| 2023-03-10 | CVE-2022-40530 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in WLAN due to integer overflow to buffer overflow in WLAN during initialization phase. | 7.8 |