Vulnerabilities > Qualcomm > Qcn7606 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2025-01-06 | CVE-2024-45541 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption when IOCTL call is invoked from user-space to read board data. | 7.8 |
| 2025-01-06 | CVE-2024-45542 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when IOCTL call is invoked from user-space to write board data to WLAN driver. | 7.8 |
| 2024-12-02 | CVE-2024-43050 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while invoking IOCTL calls from user space to issue factory test command inside WLAN driver. | 7.8 |
| 2024-09-02 | CVE-2024-33051 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while processing TIM IE from beacon frame as there is no check for IE length. | 7.5 |
| 2024-07-01 | CVE-2024-21461 | Double Free vulnerability in Qualcomm products Memory corruption while performing finish HMAC operation when context is freed by keymaster. | 7.8 |
| 2024-07-01 | CVE-2024-21465 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption while processing key blob passed by the user. | 7.8 |
| 2024-07-01 | CVE-2024-21469 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when an invoke call and a TEE call are bound for the same trusted application. | 7.8 |
| 2024-04-01 | CVE-2023-28547 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in SPS Application while requesting for public key in sorter TA. | 7.8 |
| 2024-04-01 | CVE-2023-33023 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption while processing finish_sign command to pass a rsp buffer. | 7.8 |
| 2024-02-06 | CVE-2023-33072 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Core while processing control functions. | 7.8 |