Vulnerabilities > Qualcomm > Qcn6024 Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-10-03 | CVE-2023-33027 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing rsn ies. | 7.5 |
2023-10-03 | CVE-2023-33029 | Use After Free vulnerability in Qualcomm products Memory corruption in DSP Service during a remote call from HLOS to DSP. | 7.8 |
2023-09-05 | CVE-2022-33275 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption due to improper validation of array index in WLAN HAL when received lm_itemNum is out of range. | 7.8 |
2023-09-05 | CVE-2023-21646 | Reachable Assertion vulnerability in Qualcomm products Transient DOS in Modem while processing invalid System Information Block 1. | 7.5 |
2023-09-05 | CVE-2023-21653 | Reachable Assertion vulnerability in Qualcomm products Transient DOS in Modem while processing RRC reconfiguration message. | 7.5 |
2023-09-05 | CVE-2023-21662 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Core Platform while printing the response buffer in log. | 7.8 |
2023-09-05 | CVE-2023-21664 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Core Platform while printing the response buffer in log. | 7.8 |
2023-09-05 | CVE-2023-28544 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in WLAN while sending transmit command from HLOS to UTF handlers. | 7.8 |
2023-09-05 | CVE-2023-28548 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption in WLAN HAL while processing Tx/Rx commands from QDART. | 7.8 |
2023-09-05 | CVE-2023-28549 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption in WLAN HAL while parsing Rx buffer in processing TLV payload. | 7.8 |