Vulnerabilities > Qualcomm > Qcn6024 Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2024-02-06 | CVE-2023-33076 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Core when updating rollback version for TA and OTA feature is enabled. | 7.8 |
2024-02-06 | CVE-2023-43513 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while processing the event ring, the context read pointer is untrusted to HLOS and when it is passed with arbitrary values, may point to address in the middle of ring element. | 7.8 |
2024-02-06 | CVE-2023-43522 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS while key unwrapping process, when the given encrypted key is empty or NULL. | 7.5 |
2024-02-06 | CVE-2023-43523 | Reachable Assertion vulnerability in Qualcomm products Transient DOS while processing 11AZ RTT management action frame received through OTA. | 7.5 |
2024-02-06 | CVE-2023-43533 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware when the length of received beacon is less than length of ieee802.11 beacon frame. | 7.5 |
2024-02-06 | CVE-2023-43536 | Unspecified vulnerability in Qualcomm products Transient DOS while parse fils IE with length equal to 1. | 7.5 |
2024-02-06 | CVE-2023-33046 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption in Trusted Execution Environment while deinitializing an object used for license validation. | 7.0 |
2024-02-06 | CVE-2023-33049 | Memory Leak vulnerability in Qualcomm products Transient DOS in Multi-Mode Call Processor due to UE failure because of heap leakage. | 7.5 |
2024-02-06 | CVE-2023-33057 | Improper Input Validation vulnerability in Qualcomm products Transient DOS in Multi-Mode Call Processor while processing UE policy container. | 7.5 |
2024-02-06 | CVE-2023-33058 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure in Modem while processing SIB5. | 9.1 |