Vulnerabilities > Qualcomm > Qcn6024 Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2024-07-01 | CVE-2024-21461 | Double Free vulnerability in Qualcomm products Memory corruption while performing finish HMAC operation when context is freed by keymaster. | 7.8 |
2024-07-01 | CVE-2024-21462 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while loading the TA ELF file. | 5.5 |
2024-07-01 | CVE-2024-21465 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption while processing key blob passed by the user. | 7.8 |
2024-07-01 | CVE-2024-21469 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when an invoke call and a TEE call are bound for the same trusted application. | 7.8 |
2024-07-01 | CVE-2024-21482 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption during the secure boot process, when the `bootm` command is used, it bypasses the authentication of the kernel/rootfs image. | 7.8 |
2024-07-01 | CVE-2024-23373 | Use After Free vulnerability in Qualcomm products Memory corruption when IOMMU unmap operation fails, the DMA and anon buffers are getting released. | 7.8 |
2024-02-06 | CVE-2023-33072 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Core while processing control functions. | 7.8 |
2024-02-06 | CVE-2023-33076 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Core when updating rollback version for TA and OTA feature is enabled. | 7.8 |
2024-02-06 | CVE-2023-33046 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption in Trusted Execution Environment while deinitializing an object used for license validation. | 7.0 |
2024-02-06 | CVE-2023-33058 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure in Modem while processing SIB5. | 9.1 |