Vulnerabilities > Qualcomm > Qcn5124 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-06-06 | CVE-2023-21628 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while processing WMI-UTF command or FTM TLV1 command. | 7.8 |
| 2023-06-06 | CVE-2023-21658 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while processing the received beacon or probe response frame. | 7.5 |
| 2023-06-06 | CVE-2023-21659 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while processing frames with missing header fields. | 7.5 |
| 2023-06-06 | CVE-2023-21660 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing FT Information Elements. | 7.5 |
| 2023-06-06 | CVE-2023-21661 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing WLAN beacon or probe-response frame. | 7.5 |
| 2023-04-13 | CVE-2022-40532 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption due to integer overflow or wraparound in WLAN while sending WMI cmd from host to target. | 7.8 |
| 2023-03-10 | CVE-2022-25655 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in WLAN HAL while arbitrary value is passed in WMI UTF command payload. | 7.8 |
| 2023-03-10 | CVE-2022-33309 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS due to buffer over-read in WLAN Firmware while parsing secure FTMR frame with size lesser than 39 Bytes. | 7.5 |
| 2023-03-10 | CVE-2022-40527 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in WLAN while processing PEER ID populated by TQM. | 7.5 |
| 2023-03-10 | CVE-2022-40530 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in WLAN due to integer overflow to buffer overflow in WLAN during initialization phase. | 7.8 |