Vulnerabilities > Qualcomm > Qcm6490 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-07-01 | CVE-2024-23372 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption while invoking IOCTL call for GPU memory allocation and size param is greater than expected size. | 7.8 |
| 2024-07-01 | CVE-2024-23373 | Use After Free vulnerability in Qualcomm products Memory corruption when IOMMU unmap operation fails, the DMA and anon buffers are getting released. | 7.8 |
| 2024-07-01 | CVE-2024-23380 | Use After Free vulnerability in Qualcomm products Memory corruption while handling user packets during VBO bind operation. | 7.8 |
| 2024-02-06 | CVE-2023-33072 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Core while processing control functions. | 7.8 |
| 2024-02-06 | CVE-2023-43513 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while processing the event ring, the context read pointer is untrusted to HLOS and when it is passed with arbitrary values, may point to address in the middle of ring element. | 7.8 |
| 2024-02-06 | CVE-2023-43522 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS while key unwrapping process, when the given encrypted key is empty or NULL. | 7.5 |
| 2024-02-06 | CVE-2023-43533 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware when the length of received beacon is less than length of ieee802.11 beacon frame. | 7.5 |
| 2024-02-06 | CVE-2023-43536 | Unspecified vulnerability in Qualcomm products Transient DOS while parse fils IE with length equal to 1. | 7.5 |
| 2024-02-06 | CVE-2023-33049 | Memory Leak vulnerability in Qualcomm products Transient DOS in Multi-Mode Call Processor due to UE failure because of heap leakage. | 7.5 |
| 2024-02-06 | CVE-2023-33057 | Improper Input Validation vulnerability in Qualcomm products Transient DOS in Multi-Mode Call Processor while processing UE policy container. | 7.5 |