Vulnerabilities > Qualcomm > Qcm6490 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-06-06 | CVE-2022-40507 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in Core while mapping HLOS address to the list. | 7.8 |
| 2023-06-06 | CVE-2022-40521 | Improper Authentication vulnerability in Qualcomm products Transient DOS due to improper authorization in Modem | 7.5 |
| 2023-06-06 | CVE-2022-40523 | Exposure of Resource to Wrong Sphere vulnerability in Qualcomm products Information disclosure in Kernel due to indirect branch misprediction. | 5.5 |
| 2023-06-06 | CVE-2022-40529 | Incorrect Authorization vulnerability in Qualcomm products Memory corruption due to improper access control in kernel while processing a mapping request from root process. | 7.8 |
| 2023-06-06 | CVE-2022-40533 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Transient DOS due to untrusted Pointer Dereference in core while sending USB QMI request. | 5.5 |
| 2023-06-06 | CVE-2022-40536 | Improper Authentication vulnerability in Qualcomm products Transient DOS due to improper authentication in modem while receiving plain TLB OTA request message from network. | 7.5 |
| 2023-06-06 | CVE-2023-21656 | Improper Input Validation vulnerability in Qualcomm products Memory corruption in WLAN HOST while receiving an WMI event from firmware. | 7.8 |
| 2023-06-06 | CVE-2023-21657 | Improper Input Validation vulnerability in Qualcomm products Memoru corruption in Audio when ADSP sends input during record use case. | 7.8 |
| 2023-06-06 | CVE-2023-21658 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while processing the received beacon or probe response frame. | 7.5 |
| 2023-06-06 | CVE-2023-21659 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while processing frames with missing header fields. | 7.5 |