Vulnerabilities > Qualcomm > Qcc710 Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-10-03 | CVE-2023-24853 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in HLOS while registering for key provisioning notify. | 7.8 |
2023-10-03 | CVE-2023-24855 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Modem while processing security related configuration before AS Security Exchange. | 9.8 |
2023-10-03 | CVE-2023-28539 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in WLAN Host when the firmware invokes multiple WMI Service Available command. | 7.8 |
2023-10-03 | CVE-2023-28540 | Improper Authentication vulnerability in Qualcomm products Cryptographic issue in Data Modem due to improper authentication during TLS handshake. | 7.5 |
2023-10-03 | CVE-2023-33026 | Resource Exhaustion vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing a NAN management frame. | 7.5 |
2023-10-03 | CVE-2023-33027 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing rsn ies. | 7.5 |
2023-10-03 | CVE-2023-33028 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN Firmware while doing a memory copy of pmk cache. | 9.8 |
2023-10-03 | CVE-2023-33029 | Use After Free vulnerability in Qualcomm products Memory corruption in DSP Service during a remote call from HLOS to DSP. | 7.8 |
2023-10-03 | CVE-2023-33035 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption while invoking callback function of AFE from ADSP. | 7.8 |
2022-06-14 | CVE-2021-35129 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in BT controller due to improper length check while processing vendor specific commands in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking | 7.8 |