Vulnerabilities > Qualcomm > Qca8337 Firmware > Medium

DATE CVE VULNERABILITY TITLE RISK
2022-06-14 CVE-2021-30343 Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products
Improper integrity check can lead to race condition between tasks PDCP and RRC? after a valid RRC Command packet has been received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
network
high complexity
qualcomm CWE-367
5.9
2022-06-14 CVE-2021-30349 Unspecified vulnerability in Qualcomm products
Improper access control sequence for AC database after memory allocation can lead to possible memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm
6.7
2022-06-14 CVE-2021-35071 Out-of-bounds Read vulnerability in Qualcomm products
Possible buffer over read due to lack of size validation while copying data from DBR buffer to RX buffer and can lead to Denial of Service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-125
5.5
2022-06-14 CVE-2021-35092 Improper Input Validation vulnerability in Qualcomm products
Processing DCB/AVB algorithm with an invalid queue index from IOCTL request could lead to arbitrary address modification in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
local
low complexity
qualcomm CWE-20
6.7
2022-06-14 CVE-2021-35111 Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products
Improper validation of tag id while RRC sending tag id to MAC can lead to TOCTOU race condition in Snapdragon Connectivity, Snapdragon Mobile
network
high complexity
qualcomm CWE-367
5.9
2022-06-14 CVE-2021-35118 Out-of-bounds Write vulnerability in Qualcomm products
An out-of-bounds write can occur due to an incorrect input check in the camera driver in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-787
6.7
2022-06-14 CVE-2021-35119 Out-of-bounds Read vulnerability in Qualcomm products
Potential out of Bounds read in FIPS event processing due to improper validation of the length from the firmware in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
local
low complexity
qualcomm CWE-125
5.5
2022-06-14 CVE-2021-35120 Use After Free vulnerability in Qualcomm products
Improper handling between export and release functions on the same handle from client can lead to use after free in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
local
low complexity
qualcomm CWE-416
6.7
2022-04-01 CVE-2021-30331 Classic Buffer Overflow vulnerability in Qualcomm products
Possible buffer overflow due to improper data validation of external commands sent via DIAG interface in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
local
low complexity
qualcomm CWE-120
5.5
2022-02-11 CVE-2021-30324 Classic Buffer Overflow vulnerability in Qualcomm products
Possible out of bound write due to lack of boundary check for the maximum size of buffer when sending a DCI packet to remote process in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-120
6.7