Vulnerabilities > Qualcomm > Qca8337 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-02-06 | CVE-2023-33077 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in HLOS while converting from authorization token to HIDL vector. | 7.8 |
| 2024-02-06 | CVE-2023-43513 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while processing the event ring, the context read pointer is untrusted to HLOS and when it is passed with arbitrary values, may point to address in the middle of ring element. | 7.8 |
| 2024-02-06 | CVE-2023-43520 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when AP includes TID to link mapping IE in the beacons and STA is parsing the beacon TID to link mapping IE. | 9.8 |
| 2024-02-06 | CVE-2023-43522 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS while key unwrapping process, when the given encrypted key is empty or NULL. | 7.5 |
| 2024-02-06 | CVE-2023-43523 | Reachable Assertion vulnerability in Qualcomm products Transient DOS while processing 11AZ RTT management action frame received through OTA. | 7.5 |
| 2024-02-06 | CVE-2023-43533 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware when the length of received beacon is less than length of ieee802.11 beacon frame. | 7.5 |
| 2024-02-06 | CVE-2023-43534 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption while validating the TID to Link Mapping action request frame, when a station connects to an access point. | 9.8 |
| 2024-02-06 | CVE-2023-43536 | Unspecified vulnerability in Qualcomm products Transient DOS while parse fils IE with length equal to 1. | 7.5 |
| 2024-02-06 | CVE-2023-33046 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption in Trusted Execution Environment while deinitializing an object used for license validation. | 7.0 |
| 2024-02-06 | CVE-2023-33049 | Memory Leak vulnerability in Qualcomm products Transient DOS in Multi-Mode Call Processor due to UE failure because of heap leakage. | 7.5 |