Vulnerabilities > Qualcomm > Qca8081 Firmware > High

DATE CVE VULNERABILITY TITLE RISK
2023-02-12 CVE-2022-40512 Out-of-bounds Read vulnerability in Qualcomm products
Transient DOS in WLAN Firmware due to buffer over-read while processing probe response or beacon.
network
low complexity
qualcomm CWE-125
7.5
2023-02-12 CVE-2022-40513 Resource Exhaustion vulnerability in Qualcomm products
Transient DOS due to uncontrolled resource consumption in WLAN firmware when peer is freed in non qos state.
network
low complexity
qualcomm CWE-400
7.5
2023-01-09 CVE-2022-25746 Classic Buffer Overflow vulnerability in Qualcomm products
Memory corruption in kernel due to missing checks when updating the access rights of a memextent mapping.
local
low complexity
qualcomm CWE-120
7.8
2023-01-09 CVE-2022-33276 Classic Buffer Overflow vulnerability in Qualcomm products
Memory corruption due to buffer copy without checking size of input in modem while receiving WMI_REQUEST_STATS_CMDID command.
local
low complexity
qualcomm CWE-120
7.8
2023-01-09 CVE-2022-40516 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in Core due to stack-based buffer overflow.
local
low complexity
qualcomm CWE-787
7.8
2023-01-09 CVE-2022-40517 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in core due to stack-based buffer overflow
local
low complexity
qualcomm CWE-787
7.8
2023-01-09 CVE-2022-40520 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption due to stack-based buffer overflow in Core
local
low complexity
qualcomm CWE-787
7.8
2022-12-13 CVE-2022-25672 Reachable Assertion vulnerability in Qualcomm products
Denial of service in MODEM due to reachable assertion while processing SIB1 with invalid Bandwidth in Snapdragon Mobile
network
low complexity
qualcomm CWE-617
7.5
2022-12-13 CVE-2022-25673 Reachable Assertion vulnerability in Qualcomm products
Denial of service in MODEM due to reachable assertion while processing configuration from network in Snapdragon Mobile
network
low complexity
qualcomm CWE-617
7.5
2022-12-13 CVE-2022-25677 Use After Free vulnerability in Qualcomm products
Memory corruption in diag due to use after free while processing dci packet in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-416
7.8