Vulnerabilities > Qualcomm > Qca7550 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-09-05 | CVE-2023-28565 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while handling command streams through WMI interfaces. | 7.8 |
| 2022-01-03 | CVE-2021-30303 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to lack of buffer length check when segmented WMI command is received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-09-09 | CVE-2021-1909 | Classic Buffer Overflow vulnerability in Qualcomm products Buffer overflow occurs in trusted applications due to lack of length check of parameters in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-09-08 | CVE-2020-11301 | Improper Authentication vulnerability in Qualcomm products Improper authentication of un-encrypted plaintext Wi-Fi frames in an encrypted network can lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.5 |
| 2021-07-13 | CVE-2021-1887 | Reachable Assertion vulnerability in Qualcomm products An assertion can be reached in the WLAN subsystem while using the Wi-Fi Fine Timing Measurement protocol in Snapdragon Wired Infrastructure and Networking | 7.5 |
| 2021-06-09 | CVE-2020-11267 | Out-of-bounds Write vulnerability in Qualcomm products Stack out-of-bounds write occurs while setting up a cipher device if the provided IV length exceeds the max limit value in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-06-09 | CVE-2020-11235 | Integer Overflow or Wraparound vulnerability in Qualcomm products Buffer overflow might occur while parsing unified command due to lack of check of input data received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-06-09 | CVE-2020-11256 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption due to lack of check of validation of pointer to buffer passed to trustzone in Snapdragon Wired Infrastructure and Networking | 8.8 |
| 2021-06-09 | CVE-2020-11257 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption due to lack of validation of pointer arguments passed to TrustZone BSP in Snapdragon Wired Infrastructure and Networking | 8.8 |
| 2021-06-09 | CVE-2020-11258 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption due to lack of validation of pointer arguments passed to Trustzone BSP in Snapdragon Wired Infrastructure and Networking | 8.8 |