Vulnerabilities > Qualcomm > Qca7550 Firmware > Critical
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-01-09 | CVE-2022-33265 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption due to information exposure in Powerline Communication Firmware while sending different MMEs from a single, unassociated device. | 9.8 |
| 2021-09-17 | CVE-2021-1976 | Use After Free vulnerability in Qualcomm products A use after free can occur due to improper validation of P2P device address in PD Request frame in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 10.0 |
| 2021-09-08 | CVE-2021-1972 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to improper validation of device types during P2P search in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 10.0 |