Vulnerabilities > Qualcomm > Qca7500 Firmware > Medium

DATE CVE VULNERABILITY TITLE RISK
2023-11-07 CVE-2023-28553 Unspecified vulnerability in Qualcomm products
Information Disclosure in WLAN Host when processing WMI event command.
local
low complexity
qualcomm
5.5
2023-11-07 CVE-2023-28554 Unspecified vulnerability in Qualcomm products
Information Disclosure in Qualcomm IPC while reading values from shared memory in VM.
local
low complexity
qualcomm
5.5
2023-11-07 CVE-2023-28563 Unspecified vulnerability in Qualcomm products
Information disclosure in IOE Firmware while handling WMI command.
local
low complexity
qualcomm
5.5
2023-11-07 CVE-2023-28569 Unspecified vulnerability in Qualcomm products
Information disclosure in WLAN HAL while handling command through WMI interfaces.
local
low complexity
qualcomm
5.5
2023-01-09 CVE-2022-25722 Use After Free vulnerability in Qualcomm products
Information exposure in DSP services due to improper handling of freeing memory
local
low complexity
qualcomm CWE-416
5.5
2022-10-19 CVE-2022-25666 Use After Free vulnerability in Qualcomm products
Memory corruption due to use after free in service while trying to access maps by different threads in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-416
6.7
2022-06-14 CVE-2021-35071 Out-of-bounds Read vulnerability in Qualcomm products
Possible buffer over read due to lack of size validation while copying data from DBR buffer to RX buffer and can lead to Denial of Service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-125
5.5
2022-02-11 CVE-2021-30324 Classic Buffer Overflow vulnerability in Qualcomm products
Possible out of bound write due to lack of boundary check for the maximum size of buffer when sending a DCI packet to remote process in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-120
6.7
2022-02-11 CVE-2021-30325 Improper Validation of Array Index vulnerability in Qualcomm products
Possible out of bound access of DCI resources due to lack of validation process and resource allocation in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-129
6.7
2022-01-13 CVE-2021-30313 Use After Free vulnerability in Qualcomm products
Use after free condition can occur in wired connectivity due to a race condition while creating and deleting folders in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
high complexity
qualcomm CWE-416
6.4