Vulnerabilities > Qualcomm > Qca7500 Firmware > Medium
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-11-07 | CVE-2023-28553 | Unspecified vulnerability in Qualcomm products Information Disclosure in WLAN Host when processing WMI event command. | 5.5 |
2023-11-07 | CVE-2023-28554 | Unspecified vulnerability in Qualcomm products Information Disclosure in Qualcomm IPC while reading values from shared memory in VM. | 5.5 |
2023-11-07 | CVE-2023-28563 | Unspecified vulnerability in Qualcomm products Information disclosure in IOE Firmware while handling WMI command. | 5.5 |
2023-11-07 | CVE-2023-28569 | Unspecified vulnerability in Qualcomm products Information disclosure in WLAN HAL while handling command through WMI interfaces. | 5.5 |
2023-01-09 | CVE-2022-25722 | Use After Free vulnerability in Qualcomm products Information exposure in DSP services due to improper handling of freeing memory | 5.5 |
2022-10-19 | CVE-2022-25666 | Use After Free vulnerability in Qualcomm products Memory corruption due to use after free in service while trying to access maps by different threads in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.7 |
2022-06-14 | CVE-2021-35071 | Out-of-bounds Read vulnerability in Qualcomm products Possible buffer over read due to lack of size validation while copying data from DBR buffer to RX buffer and can lead to Denial of Service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 5.5 |
2022-02-11 | CVE-2021-30324 | Classic Buffer Overflow vulnerability in Qualcomm products Possible out of bound write due to lack of boundary check for the maximum size of buffer when sending a DCI packet to remote process in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.7 |
2022-02-11 | CVE-2021-30325 | Improper Validation of Array Index vulnerability in Qualcomm products Possible out of bound access of DCI resources due to lack of validation process and resource allocation in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.7 |
2022-01-13 | CVE-2021-30313 | Use After Free vulnerability in Qualcomm products Use after free condition can occur in wired connectivity due to a race condition while creating and deleting folders in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.4 |