Vulnerabilities > Qualcomm > Qca6574Au Firmware

DATE CVE VULNERABILITY TITLE RISK
2023-02-12 CVE-2022-40514 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption due to buffer copy without checking the size of input in WLAN Firmware while processing CCKM IE in reassoc response frame.
network
low complexity
qualcomm CWE-787
critical
9.8
2023-01-09 CVE-2022-22079 Out-of-bounds Read vulnerability in Qualcomm products
Denial of service while processing fastboot flash command on mmc due to buffer over read
low complexity
qualcomm CWE-125
4.6
2023-01-09 CVE-2022-22088 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in Bluetooth HOST due to buffer overflow while parsing the command response received from remote
low complexity
qualcomm CWE-787
8.8
2023-01-09 CVE-2022-25717 Double Free vulnerability in Qualcomm products
Memory corruption in display due to double free while allocating frame buffer memory
local
low complexity
qualcomm CWE-415
7.8
2023-01-09 CVE-2022-25721 Type Confusion vulnerability in Qualcomm products
Memory corruption in video driver due to type confusion error during video playback
local
low complexity
qualcomm CWE-843
7.8
2023-01-09 CVE-2022-25722 Use After Free vulnerability in Qualcomm products
Information exposure in DSP services due to improper handling of freeing memory
local
low complexity
qualcomm CWE-416
5.5
2023-01-09 CVE-2022-25725 Release of Invalid Pointer or Reference vulnerability in Qualcomm products
Denial of service in MODEM due to improper pointer handling
local
low complexity
qualcomm CWE-763
5.5
2023-01-09 CVE-2022-25746 Classic Buffer Overflow vulnerability in Qualcomm products
Memory corruption in kernel due to missing checks when updating the access rights of a memextent mapping.
local
low complexity
qualcomm CWE-120
7.8
2023-01-09 CVE-2022-33218 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in Automotive due to improper input validation.
local
low complexity
qualcomm CWE-787
7.8
2023-01-09 CVE-2022-33219 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory corruption in Automotive due to integer overflow to buffer overflow while registering a new listener with shared buffer.
local
low complexity
qualcomm CWE-190
7.8