Vulnerabilities > Qualcomm > Qca6574 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-08-05 | CVE-2024-33014 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing ESP IE from beacon/probe response frame. | 7.5 |
| 2024-08-05 | CVE-2024-33015 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing SCAN RNR IE when bytes received from AP is such that the size of the last param of IE is less than neighbor report. | 7.5 |
| 2024-08-05 | CVE-2024-33018 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing the received TID-to-link mapping element of the TID-to-link mapping action frame. | 7.5 |
| 2024-08-05 | CVE-2024-33019 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing the received TID-to-link mapping action frame. | 7.5 |
| 2024-08-05 | CVE-2024-33020 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while processing TID-to-link mapping IE elements. | 7.5 |
| 2024-08-05 | CVE-2024-33021 | Use of Uninitialized Resource vulnerability in Qualcomm products Memory corruption while processing IOCTL call to set metainfo. | 7.8 |
| 2024-08-05 | CVE-2024-33022 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption while allocating memory in HGSL driver. | 7.8 |
| 2024-08-05 | CVE-2024-33023 | Use After Free vulnerability in Qualcomm products Memory corruption while creating a fence to wait on timeline events, and simultaneously signal timeline events. | 7.8 |
| 2024-08-05 | CVE-2024-33024 | Integer Overflow or Wraparound vulnerability in Qualcomm products Transient DOS while parsing the ML IE when a beacon with length field inside the common info of ML IE greater than the ML IE length. | 7.5 |
| 2024-08-05 | CVE-2024-33025 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing the BSS parameter change count or MLD capabilities fields of the ML IE. | 7.5 |