Vulnerabilities > Qualcomm > Qca6574 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-09-02 | CVE-2024-33052 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when user provides data for FM HCI command control operations. | 7.8 |
| 2024-09-02 | CVE-2024-33057 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing the multi-link element Control field when common information length check is missing before updating the location. | 7.5 |
| 2024-09-02 | CVE-2024-33060 | Use After Free vulnerability in Qualcomm products Memory corruption when two threads try to map and unmap a single node simultaneously. | 7.8 |
| 2024-09-02 | CVE-2024-38402 | Use After Free vulnerability in Qualcomm products Memory corruption while processing IOCTL call for getting group info. | 7.8 |
| 2024-07-01 | CVE-2024-21457 | Out-of-bounds Read vulnerability in Qualcomm products INformation disclosure while handling Multi-link IE in beacon frame. | 7.5 |
| 2024-07-01 | CVE-2024-21458 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while handling SA query action frame. | 7.5 |
| 2024-07-01 | CVE-2024-21461 | Double Free vulnerability in Qualcomm products Memory corruption while performing finish HMAC operation when context is freed by keymaster. | 7.8 |
| 2024-07-01 | CVE-2024-21465 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption while processing key blob passed by the user. | 7.8 |
| 2024-07-01 | CVE-2024-21466 | Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products Information disclosure while parsing sub-IE length during new IE generation. | 7.5 |
| 2024-07-01 | CVE-2024-21469 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when an invoke call and a TEE call are bound for the same trusted application. | 7.8 |