Vulnerabilities > Qualcomm > Qca6564Au Firmware > Medium
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-01-09 | CVE-2022-33253 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS due to buffer over-read in WLAN while parsing corrupted NAN frames. | 5.5 |
| 2023-01-09 | CVE-2022-33283 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure due to buffer over-read in WLAN while WLAN frame parsing due to missing frame length check. | 6.5 |
| 2023-01-09 | CVE-2022-33284 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure due to buffer over-read in WLAN while parsing BTM action frame. | 6.5 |
| 2023-01-09 | CVE-2022-33285 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS due to buffer over-read in WLAN while parsing WLAN CSA action frames. | 6.5 |
| 2023-01-09 | CVE-2022-33286 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS due to buffer over-read in WLAN while processing 802.11 management frames. | 6.5 |
| 2023-01-09 | CVE-2022-40518 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure due to buffer overread in Core | 5.5 |
| 2023-01-09 | CVE-2022-40519 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure due to buffer overread in Core | 5.5 |
| 2022-10-19 | CVE-2022-22078 | Integer Overflow or Wraparound vulnerability in Qualcomm products Denial of service in BOOT when partition size for a particular partition is requested due to integer overflow when blocks are calculated in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 4.6 |
| 2022-10-19 | CVE-2022-25664 | Incomplete Cleanup vulnerability in Qualcomm products Information disclosure due to exposure of information while GPU reads the data in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 5.5 |
| 2022-10-19 | CVE-2022-25666 | Use After Free vulnerability in Qualcomm products Memory corruption due to use after free in service while trying to access maps by different threads in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.7 |