Vulnerabilities > Qualcomm > Qca6431 Firmware > High

DATE CVE VULNERABILITY TITLE RISK
2023-07-04 CVE-2023-21633 Out-of-bounds Write vulnerability in Qualcomm products
Memory Corruption in Linux while processing QcRilRequestImsRegisterMultiIdentityMessage request.
local
low complexity
qualcomm CWE-787
7.8
2023-07-04 CVE-2023-22386 Out-of-bounds Write vulnerability in Qualcomm products
Memory Corruption in WLAN HOST while processing WLAN FW request to allocate memory.
local
low complexity
qualcomm CWE-787
7.8
2023-07-04 CVE-2023-22387 Unspecified vulnerability in Qualcomm products
Arbitrary memory overwrite when VM gets compromised in TX write leading to Memory Corruption.
local
low complexity
qualcomm
7.8
2023-07-04 CVE-2023-22667 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory Corruption in Audio while allocating the ion buffer during the music playback.
local
low complexity
qualcomm CWE-190
7.8
2023-07-04 CVE-2023-28541 Out-of-bounds Read vulnerability in Qualcomm products
Memory Corruption in Data Modem while processing DMA buffer release event about CFR data.
local
low complexity
qualcomm CWE-125
7.8
2023-07-04 CVE-2023-28542 Out-of-bounds Read vulnerability in Qualcomm products
Memory Corruption in WLAN HOST while fetching TX status information.
local
low complexity
qualcomm CWE-125
7.8
2023-06-06 CVE-2022-22060 Reachable Assertion vulnerability in Qualcomm products
Assertion occurs while processing Reconfiguration message due to improper validation
network
low complexity
qualcomm CWE-617
7.5
2023-06-06 CVE-2022-33251 Reachable Assertion vulnerability in Qualcomm products
Transient DOS due to reachable assertion in Modem because of invalid network configuration.
network
low complexity
qualcomm CWE-617
7.5
2023-06-06 CVE-2022-33264 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message.
local
low complexity
qualcomm CWE-787
7.8
2023-06-06 CVE-2022-33307 Double Free vulnerability in Qualcomm products
Memory Corruption due to double free in automotive when a bad HLOS address for one of the lists to be mapped is passed.
local
low complexity
qualcomm CWE-415
7.8