Vulnerabilities > Qualcomm > Qca6431 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-09-02 | CVE-2024-33051 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while processing TIM IE from beacon frame as there is no check for IE length. | 7.5 |
| 2024-09-02 | CVE-2024-33052 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when user provides data for FM HCI command control operations. | 7.8 |
| 2024-08-05 | CVE-2024-21459 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while handling beacon or probe response frame in STA. | 7.5 |
| 2024-08-05 | CVE-2024-21467 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure while handling beacon probe frame during scan entry generation in client side. | 7.5 |
| 2024-08-05 | CVE-2024-23355 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when keymaster operation imports a shared key. | 7.8 |
| 2024-07-01 | CVE-2024-21461 | Double Free vulnerability in Qualcomm products Memory corruption while performing finish HMAC operation when context is freed by keymaster. | 7.8 |
| 2024-07-01 | CVE-2024-21465 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption while processing key blob passed by the user. | 7.8 |
| 2024-07-01 | CVE-2024-21469 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when an invoke call and a TEE call are bound for the same trusted application. | 7.8 |
| 2024-02-06 | CVE-2023-33072 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Core while processing control functions. | 7.8 |
| 2024-02-06 | CVE-2023-33076 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Core when updating rollback version for TA and OTA feature is enabled. | 7.8 |