Vulnerabilities > Qualcomm > Qca6430 Firmware > High

DATE CVE VULNERABILITY TITLE RISK
2023-01-09 CVE-2022-22088 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in Bluetooth HOST due to buffer overflow while parsing the command response received from remote
low complexity
qualcomm CWE-787
8.8
2023-01-09 CVE-2022-25715 Incorrect Type Conversion or Cast vulnerability in Qualcomm products
Memory corruption in display driver due to incorrect type casting while accessing the fence structure fields
local
low complexity
qualcomm CWE-704
7.8
2023-01-09 CVE-2022-25717 Double Free vulnerability in Qualcomm products
Memory corruption in display due to double free while allocating frame buffer memory
local
low complexity
qualcomm CWE-415
7.8
2023-01-09 CVE-2022-25721 Type Confusion vulnerability in Qualcomm products
Memory corruption in video driver due to type confusion error during video playback
local
low complexity
qualcomm CWE-843
7.8
2023-01-09 CVE-2022-25746 Classic Buffer Overflow vulnerability in Qualcomm products
Memory corruption in kernel due to missing checks when updating the access rights of a memextent mapping.
local
low complexity
qualcomm CWE-120
7.8
2023-01-09 CVE-2022-33266 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory corruption in Audio due to integer overflow to buffer overflow while music playback of clips like amr,evrc,qcelp with modified content.
local
low complexity
qualcomm CWE-190
7.8
2023-01-09 CVE-2022-40516 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in Core due to stack-based buffer overflow.
local
low complexity
qualcomm CWE-787
7.8
2023-01-09 CVE-2022-40517 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in core due to stack-based buffer overflow
local
low complexity
qualcomm CWE-787
7.8
2023-01-09 CVE-2022-40520 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption due to stack-based buffer overflow in Core
local
low complexity
qualcomm CWE-787
7.8
2022-12-13 CVE-2022-25677 Use After Free vulnerability in Qualcomm products
Memory corruption in diag due to use after free while processing dci packet in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-416
7.8