Vulnerabilities > Qualcomm > Qca6426 Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-12-05 | CVE-2023-33024 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption while sending SMS from AP firmware. | 7.8 |
2023-12-05 | CVE-2023-33042 | Improper Input Validation vulnerability in Qualcomm products Transient DOS in Modem after RRC Setup message is received. | 7.5 |
2023-12-05 | CVE-2023-33044 | Reachable Assertion vulnerability in Qualcomm products Transient DOS in Data modem while handling TLB control messages from the Network. | 7.5 |
2023-12-05 | CVE-2023-33063 | Use After Free vulnerability in Qualcomm products Memory corruption in DSP Services during a remote call from HLOS to DSP. | 7.8 |
2023-12-05 | CVE-2023-33079 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption in Audio while running invalid audio recording from ADSP. | 7.8 |
2023-12-05 | CVE-2023-33080 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame. | 7.5 |
2023-12-05 | CVE-2023-33081 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while converting TWT (Target Wake Time) frame parameters in the OTA broadcast. | 7.5 |
2023-12-05 | CVE-2023-33088 | NULL Pointer Dereference vulnerability in Qualcomm products Memory corruption when processing cmd parameters while parsing vdev. | 7.8 |
2023-12-05 | CVE-2023-33089 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS when processing a NULL buffer while parsing WLAN vdev. | 7.5 |
2023-12-05 | CVE-2023-33098 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing WPA IES, when it is passed with length more than expected size. | 7.5 |