Vulnerabilities > Qualcomm > Qca6390 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-08-08 | CVE-2023-21652 | Use of Hard-coded Credentials vulnerability in Qualcomm products Cryptographic issue in HLOS as derived keys used to encrypt/decrypt information is present on stack after use. | 7.1 |
| 2023-08-08 | CVE-2023-22666 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Audio while playing amrwbplus clips with modified content. | 7.8 |
| 2023-08-08 | CVE-2023-28537 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while allocating memory in COmxApeDec module in Audio. | 7.8 |
| 2023-06-06 | CVE-2022-22060 | Reachable Assertion vulnerability in Qualcomm products Assertion occurs while processing Reconfiguration message due to improper validation | 7.5 |
| 2023-06-06 | CVE-2022-33227 | Double Free vulnerability in Qualcomm products Memory corruption in Linux android due to double free while calling unregister provider after register call. | 7.8 |
| 2023-06-06 | CVE-2022-33251 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in Modem because of invalid network configuration. | 7.5 |
| 2023-06-06 | CVE-2022-33264 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message. | 7.8 |
| 2023-06-06 | CVE-2022-33267 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Linux while sending DRM request. | 7.8 |
| 2023-06-06 | CVE-2022-33307 | Double Free vulnerability in Qualcomm products Memory Corruption due to double free in automotive when a bad HLOS address for one of the lists to be mapped is passed. | 7.8 |
| 2023-06-06 | CVE-2022-40507 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in Core while mapping HLOS address to the list. | 7.8 |