Vulnerabilities > Qualcomm > Qca6390 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-05-07 | CVE-2020-11294 | Improper Validation of Array Index vulnerability in Qualcomm products Out of bound write in logger due to prefix size is not validated while prepended to logging string in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.8 |
| 2021-05-07 | CVE-2020-11295 | Use After Free vulnerability in Qualcomm products Use after free in camera If the threadmanager is being cleaned up while the worker thread is processing objects in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |
| 2021-05-07 | CVE-2021-1891 | Use After Free vulnerability in Qualcomm products A possible use-after-free occurrence in audio driver can happen when pointers are not properly handled in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-05-07 | CVE-2021-1895 | Integer Overflow or Wraparound vulnerability in Qualcomm products Possible integer overflow due to improper length check while flashing an image in Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music | 7.8 |
| 2021-05-07 | CVE-2021-1905 | Use After Free vulnerability in Qualcomm products Possible use after free due to improper handling of memory mapping of multiple processes simultaneously. | 7.8 |
| 2021-05-07 | CVE-2021-1915 | Classic Buffer Overflow vulnerability in Qualcomm products Buffer overflow can occur due to improper validation of NDP application information length in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-05-07 | CVE-2021-1925 | Reachable Assertion vulnerability in Qualcomm products Possible denial of service scenario due to improper handling of group management action frame in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.5 |
| 2021-05-07 | CVE-2021-1927 | Use After Free vulnerability in Qualcomm products Possible use after free due to lack of null check while memory is being freed in FastRPC driver in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-04-07 | CVE-2020-11255 | Memory Leak vulnerability in Qualcomm products Denial of service while processing RTCP packets containing multiple SDES reports due to memory for last SDES packet is freed and rest of the memory is leaked in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables | 7.5 |
| 2021-04-07 | CVE-2020-11246 | Double Free vulnerability in Qualcomm products A double free condition can occur when the device moves to suspend mode during secure playback in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |