Vulnerabilities > Qualcomm > Qca6390 Firmware > High

DATE CVE VULNERABILITY TITLE RISK
2023-02-12 CVE-2022-40512 Out-of-bounds Read vulnerability in Qualcomm products
Transient DOS in WLAN Firmware due to buffer over-read while processing probe response or beacon.
network
low complexity
qualcomm CWE-125
7.5
2023-01-09 CVE-2022-22088 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in Bluetooth HOST due to buffer overflow while parsing the command response received from remote
low complexity
qualcomm CWE-787
8.8
2023-01-09 CVE-2022-25746 Classic Buffer Overflow vulnerability in Qualcomm products
Memory corruption in kernel due to missing checks when updating the access rights of a memextent mapping.
local
low complexity
qualcomm CWE-120
7.8
2023-01-09 CVE-2022-33266 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory corruption in Audio due to integer overflow to buffer overflow while music playback of clips like amr,evrc,qcelp with modified content.
local
low complexity
qualcomm CWE-190
7.8
2023-01-09 CVE-2022-33276 Classic Buffer Overflow vulnerability in Qualcomm products
Memory corruption due to buffer copy without checking size of input in modem while receiving WMI_REQUEST_STATS_CMDID command.
local
low complexity
qualcomm CWE-120
7.8
2023-01-09 CVE-2022-33300 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in Automotive Android OS due to improper input validation.
local
low complexity
qualcomm CWE-787
7.8
2023-01-09 CVE-2022-40516 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in Core due to stack-based buffer overflow.
local
low complexity
qualcomm CWE-787
7.8
2023-01-09 CVE-2022-40517 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in core due to stack-based buffer overflow
local
low complexity
qualcomm CWE-787
7.8
2023-01-09 CVE-2022-40520 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption due to stack-based buffer overflow in Core
local
low complexity
qualcomm CWE-787
7.8
2022-12-13 CVE-2022-25677 Use After Free vulnerability in Qualcomm products
Memory corruption in diag due to use after free while processing dci packet in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-416
7.8