Vulnerabilities > Qualcomm > Qca6390 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-03-17 | CVE-2020-11290 | Use After Free vulnerability in Qualcomm products Use after free condition in msm ioctl events due to race between the ioctl register and deregister events in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 6.9 |
| 2021-03-17 | CVE-2020-11230 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Potential arbitrary memory corruption when the qseecom driver updates ion physical addresses in the buffer as it exposes a physical address to user land in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 4.4 |
| 2021-03-17 | CVE-2020-11228 | Improper Privilege Management vulnerability in Qualcomm products Part of RPM region was not protected from xblSec itself due to improper policy and leads to unprivileged access in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking | 4.6 |
| 2021-03-17 | CVE-2020-11227 | Improper Validation of Array Index vulnerability in Qualcomm products Out of bound write while parsing RTT/TTY packet parsing due to lack of check of buffer size before copying into buffer in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.5 |
| 2021-03-17 | CVE-2020-11226 | Improper Validation of Array Index vulnerability in Qualcomm products Out of bound memory read in Data modem while unpacking data due to lack of offset length check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 5.0 |
| 2021-03-17 | CVE-2020-11222 | Out-of-bounds Read vulnerability in Qualcomm products Buffer over read while processing MT SMS with maximum length due to improper length check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile | 6.4 |
| 2021-03-17 | CVE-2020-11221 | Information Exposure vulnerability in Qualcomm products Usage of syscall by non-secure entity can allow extraction of secure QTEE diagnostic information in clear text form due to insufficient checks in the syscall handler and leads to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 2.1 |
| 2021-03-17 | CVE-2020-11220 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products While processing storage SCM commands there is a time of check or time of use window where a pointer used could be invalid at a specific time while executing the storage SCM call in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking | 4.4 |
| 2021-03-17 | CVE-2020-11218 | Reachable Assertion vulnerability in Qualcomm products Denial of service in baseband when NW configures LTE betaOffset-RI-Index due to lack of data validation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 5.0 |
| 2021-03-17 | CVE-2020-11199 | Information Exposure vulnerability in Qualcomm products HLOS to access EL3 stack canary by just mapping imem region due to Improper access control and can lead to information exposure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 2.1 |