Vulnerabilities > Qualcomm > Qca6390 Firmware

DATE CVE VULNERABILITY TITLE RISK
2022-01-03 CVE-2021-30337 Use After Free vulnerability in Qualcomm products
Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-416
7.2
2022-01-03 CVE-2021-30348 Resource Exhaustion vulnerability in Qualcomm products
Improper validation of LLM utility timers availability can lead to denial of service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
low complexity
qualcomm CWE-400
3.3
2022-01-03 CVE-2021-30351 Classic Buffer Overflow vulnerability in Qualcomm products
An out of bound memory access can occur due to improper validation of number of frames being passed during music playback in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
network
low complexity
qualcomm CWE-120
7.5
2021-11-12 CVE-2021-1903 Incorrect Authorization vulnerability in Qualcomm products
Possible denial of service scenario can occur due to lack of length check on Channel Switch Announcement IE in beacon or probe response frame in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
network
low complexity
qualcomm CWE-863
5.0
2021-11-12 CVE-2021-1912 Integer Overflow or Wraparound vulnerability in Qualcomm products
Possible integer overflow can occur due to improper length check while calculating count and grace period in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
local
low complexity
qualcomm CWE-190
7.2
2021-11-12 CVE-2021-1921 Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products
Possible memory corruption due to Improper handling of hypervisor unmap operations for concurrent memory operations in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
6.9
2021-11-12 CVE-2021-1924 Information Exposure Through Discrepancy vulnerability in Qualcomm products
Information disclosure through timing and power side-channels during mod exponentiation for RSA-CRT in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-203
2.1
2021-11-12 CVE-2021-1973 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
A FTM Diag command can allow an arbitrary write into modem OS space in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-119
7.2
2021-11-12 CVE-2021-1975 Out-of-bounds Write vulnerability in Qualcomm products
Possible heap overflow due to improper length check of domain while parsing the DNS response in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables
network
low complexity
qualcomm CWE-787
critical
10.0
2021-11-12 CVE-2021-1979 Out-of-bounds Write vulnerability in Qualcomm products
Possible buffer overflow due to improper validation of FTM command payload in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
local
low complexity
qualcomm CWE-787
7.2