Vulnerabilities > Qualcomm > Qca6320 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-09-08 | CVE-2021-1920 | Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products Integer underflow can occur due to improper handling of incoming RTCP packets in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 9.8 |
| 2021-09-08 | CVE-2021-1928 | Out-of-bounds Read vulnerability in Qualcomm products Buffer over read could occur due to incorrect check of buffer size while flashing emmc devices in Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.1 |
| 2021-09-08 | CVE-2021-1972 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to improper validation of device types during P2P search in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 9.8 |
| 2021-07-13 | CVE-2020-11307 | Improper Validation of Array Index vulnerability in Qualcomm products Buffer overflow in modem due to improper array index check before copying into it in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 9.8 |
| 2021-07-13 | CVE-2021-1886 | Out-of-bounds Write vulnerability in Qualcomm products Incorrect handling of pointers in trusted application key import mechanism could cause memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2021-07-13 | CVE-2021-1887 | Reachable Assertion vulnerability in Qualcomm products An assertion can be reached in the WLAN subsystem while using the Wi-Fi Fine Timing Measurement protocol in Snapdragon Wired Infrastructure and Networking | 7.5 |
| 2021-07-13 | CVE-2021-1888 | Double Free vulnerability in Qualcomm products Memory corruption in key parsing and import function due to double freeing the same heap allocation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2021-07-13 | CVE-2021-1889 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to lack of length check in Trusted Application in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2021-07-13 | CVE-2021-1890 | Out-of-bounds Write vulnerability in Qualcomm products Improper length check of public exponent in RSA import key function could cause memory corruption. | 7.8 |
| 2021-07-13 | CVE-2021-1931 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to improper validation of buffer length while processing fast boot commands in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 6.7 |