Vulnerabilities > Qualcomm > Qca6310 Firmware > High

DATE CVE VULNERABILITY TITLE RISK
2023-12-05 CVE-2023-33024 Classic Buffer Overflow vulnerability in Qualcomm products
Memory corruption while sending SMS from AP firmware.
local
low complexity
qualcomm CWE-120
7.8
2023-12-05 CVE-2023-33063 Use After Free vulnerability in Qualcomm products
Memory corruption in DSP Services during a remote call from HLOS to DSP.
local
low complexity
qualcomm CWE-416
7.8
2023-12-05 CVE-2023-33080 Out-of-bounds Read vulnerability in Qualcomm products
Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame.
network
low complexity
qualcomm CWE-125
7.5
2023-12-05 CVE-2023-33092 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
Memory corruption while processing pin reply in Bluetooth, when pin code received from APP layer is greater than expected size.
local
low complexity
qualcomm CWE-119
7.8
2023-12-05 CVE-2023-33107 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory corruption in Graphics Linux while assigning shared virtual memory region during IOCTL call.
local
low complexity
qualcomm CWE-190
7.8
2023-11-07 CVE-2023-24852 Out-of-bounds Write vulnerability in Qualcomm products
Memory Corruption in Core due to secure memory access by user while loading modem image.
local
low complexity
qualcomm CWE-787
7.8
2023-11-07 CVE-2023-28545 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in TZ Secure OS while loading an app ELF.
local
low complexity
qualcomm CWE-787
7.8
2023-11-07 CVE-2023-28570 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption while processing audio effects.
local
low complexity
qualcomm CWE-787
7.8
2023-11-07 CVE-2023-28574 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in core services when Diag handler receives a command to configure event listeners.
local
low complexity
qualcomm CWE-787
7.8
2023-11-07 CVE-2023-33031 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in Automotive Audio while copying data from ADSP shared buffer to the VOC packet data buffer.
local
low complexity
qualcomm CWE-787
7.8