High

DATE	CVE	VULNERABILITY TITLE	RISK
2023-12-05	CVE-2023-28550	Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in MPP performance while accessing DSM watermark using external memory address. local low complexity qualcomm CWE-787	7.8
2023-12-05	CVE-2023-28551	Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in UTILS when modem processes memory specific Diag commands having arbitrary address values as input arguments. local low complexity qualcomm CWE-787	7.8
2023-12-05	CVE-2023-28585	Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption while loading an ELF segment in TEE Kernel. local low complexity qualcomm CWE-119	8.8
2023-12-05	CVE-2023-28588	Integer Overflow or Wraparound vulnerability in Qualcomm products Transient DOS in Bluetooth Host while rfc slot allocation. network low complexity qualcomm CWE-190	7.5
2023-12-05	CVE-2023-33017	Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Boot while running a ListVars test in UEFI Menu during boot. local low complexity qualcomm CWE-120	7.8
2023-12-05	CVE-2023-33018	Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption while using the UIM diag command to get the operators name. local low complexity qualcomm CWE-190	7.8
2023-12-05	CVE-2023-33024	Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption while sending SMS from AP firmware. local low complexity qualcomm CWE-120	7.8
2023-12-05	CVE-2023-33063	Use After Free vulnerability in Qualcomm products Memory corruption in DSP Services during a remote call from HLOS to DSP. local low complexity qualcomm CWE-416	7.8
2023-12-05	CVE-2023-33080	Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame. network low complexity qualcomm CWE-125	7.5
2023-12-05	CVE-2023-33092	Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption while processing pin reply in Bluetooth, when pin code received from APP layer is greater than expected size. local low complexity qualcomm CWE-119	7.8