Vulnerabilities > Qualcomm > Qca6310 Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2024-07-01 | CVE-2024-21469 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when an invoke call and a TEE call are bound for the same trusted application. | 7.8 |
2024-07-01 | CVE-2024-23368 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption when allocating and accessing an entry in an SMEM partition. | 7.8 |
2024-07-01 | CVE-2024-23373 | Use After Free vulnerability in Qualcomm products Memory corruption when IOMMU unmap operation fails, the DMA and anon buffers are getting released. | 7.8 |
2024-07-01 | CVE-2024-23380 | Use After Free vulnerability in Qualcomm products Memory corruption while handling user packets during VBO bind operation. | 7.8 |
2024-02-06 | CVE-2023-33067 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio while calling START command on host voice PCM multiple times for the same RX or TX tap points. | 7.8 |
2024-02-06 | CVE-2023-33068 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Audio while processing IIR config data from AFE calibration block. | 7.8 |
2024-02-06 | CVE-2023-33069 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Audio while processing the calibration data returned from ACDB loader. | 7.8 |
2024-02-06 | CVE-2023-33072 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Core while processing control functions. | 7.8 |
2024-02-06 | CVE-2023-33076 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Core when updating rollback version for TA and OTA feature is enabled. | 7.8 |
2024-02-06 | CVE-2023-33077 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in HLOS while converting from authorization token to HIDL vector. | 7.8 |