Vulnerabilities > Qualcomm > Qca6174A Firmware > High

DATE CVE VULNERABILITY TITLE RISK
2023-12-05 CVE-2023-33053 Improper Validation of Array Index vulnerability in Qualcomm products
Memory corruption in Kernel while parsing metadata.
local
low complexity
qualcomm CWE-129
7.8
2023-12-05 CVE-2023-33063 Use After Free vulnerability in Qualcomm products
Memory corruption in DSP Services during a remote call from HLOS to DSP.
local
low complexity
qualcomm CWE-416
7.8
2023-12-05 CVE-2023-33080 Out-of-bounds Read vulnerability in Qualcomm products
Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame.
network
low complexity
qualcomm CWE-125
7.5
2023-12-05 CVE-2023-33106 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
Memory corruption while submitting a large list of sync points in an AUX command to the IOCTL_KGSL_GPU_AUX_COMMAND.
local
low complexity
qualcomm CWE-119
7.8
2023-12-05 CVE-2023-33107 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory corruption in Graphics Linux while assigning shared virtual memory region during IOCTL call.
local
low complexity
qualcomm CWE-190
7.8
2023-11-07 CVE-2023-24852 Out-of-bounds Write vulnerability in Qualcomm products
Memory Corruption in Core due to secure memory access by user while loading modem image.
local
low complexity
qualcomm CWE-787
7.8
2023-11-07 CVE-2023-28545 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in TZ Secure OS while loading an app ELF.
local
low complexity
qualcomm CWE-787
7.8
2023-11-07 CVE-2023-28556 Unspecified vulnerability in Qualcomm products
Cryptographic issue in HLOS during key management.
local
low complexity
qualcomm
7.8
2023-11-07 CVE-2023-28572 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in WLAN HOST while processing the WLAN scan descriptor list.
network
low complexity
qualcomm CWE-787
8.8
2023-11-07 CVE-2023-33031 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in Automotive Audio while copying data from ADSP shared buffer to the VOC packet data buffer.
local
low complexity
qualcomm CWE-787
7.8