Vulnerabilities > Qualcomm > Qca6174 Firmware > Medium
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-04-13 | CVE-2022-33289 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption occurs in Modem due to improper validation of array index when malformed APDU is sent from card. | 6.8 |
| 2023-01-09 | CVE-2022-33285 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS due to buffer over-read in WLAN while parsing WLAN CSA action frames. | 6.5 |
| 2023-01-09 | CVE-2022-33286 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS due to buffer over-read in WLAN while processing 802.11 management frames. | 6.5 |
| 2021-11-12 | CVE-2021-1924 | Information Exposure Through Discrepancy vulnerability in Qualcomm products Information disclosure through timing and power side-channels during mod exponentiation for RSA-CRT in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 5.5 |
| 2021-09-08 | CVE-2021-1904 | Incorrect Comparison vulnerability in Qualcomm products Child process can leak information from parent process due to numeric pids are getting compared and these pid can be reused in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 5.5 |
| 2021-07-13 | CVE-2021-1896 | Cleartext Transmission of Sensitive Information vulnerability in Qualcomm products Weak configuration in WLAN could cause forwarding of unencrypted packets from one client to another in Snapdragon Compute, Snapdragon Connectivity | 4.3 |