Vulnerabilities > Qualcomm > Qca6174 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-10-03 | CVE-2023-24848 | Unspecified vulnerability in Qualcomm products Information Disclosure in Data Modem while performing a VoLTE call with an undefined RTCP FB line value. | 7.5 |
| 2023-09-05 | CVE-2023-28560 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while processing devIndex from untrusted WMI payload. | 7.8 |
| 2023-09-05 | CVE-2023-28565 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while handling command streams through WMI interfaces. | 7.8 |
| 2023-06-06 | CVE-2022-33264 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message. | 7.8 |
| 2023-06-06 | CVE-2022-40521 | Improper Authentication vulnerability in Qualcomm products Transient DOS due to improper authorization in Modem | 7.5 |
| 2023-06-06 | CVE-2023-21628 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while processing WMI-UTF command or FTM TLV1 command. | 7.8 |
| 2023-05-02 | CVE-2023-21665 | Incorrect Type Conversion or Cast vulnerability in Qualcomm products Memory corruption in Graphics while importing a file. | 7.8 |
| 2023-05-02 | CVE-2023-21666 | Memory Leak vulnerability in Qualcomm products Memory Corruption in Graphics while accessing a buffer allocated through the graphics pool. | 7.8 |
| 2023-04-13 | CVE-2022-33289 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption occurs in Modem due to improper validation of array index when malformed APDU is sent from card. | 6.8 |
| 2023-04-13 | CVE-2022-33302 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption due to improper validation of array index in User Identity Module when APN TLV length is greater than command length. | 7.8 |