Vulnerabilities > Qualcomm > Qca1023 Firmware > High

DATE CVE VULNERABILITY TITLE RISK
2024-01-02 CVE-2023-43511 Infinite Loop vulnerability in Qualcomm products
Transient DOS while parsing IPv6 extension header when WLAN firmware receives an IPv6 packet that contains `IPPROTO_NONE` as the next header.
network
low complexity
qualcomm CWE-835
7.5
2023-09-05 CVE-2023-28565 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in WLAN HAL while handling command streams through WMI interfaces.
local
low complexity
qualcomm CWE-787
7.8
2023-06-06 CVE-2023-21628 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in WLAN HAL while processing WMI-UTF command or FTM TLV1 command.
local
low complexity
qualcomm CWE-787
7.8
2023-02-12 CVE-2022-40512 Out-of-bounds Read vulnerability in Qualcomm products
Transient DOS in WLAN Firmware due to buffer over-read while processing probe response or beacon.
network
low complexity
qualcomm CWE-125
7.5
2022-12-13 CVE-2022-33238 Infinite Loop vulnerability in Qualcomm products
Transient DOS due to loop with unreachable exit condition in WLAN while processing an incoming FTM frames.
network
low complexity
qualcomm CWE-835
7.5
2022-10-19 CVE-2022-25749 Out-of-bounds Read vulnerability in Qualcomm products
Transient Denial-of-Service in WLAN due to buffer over-read while parsing MDNS frames.
network
low complexity
qualcomm CWE-125
7.5
2022-01-03 CVE-2021-30303 Classic Buffer Overflow vulnerability in Qualcomm products
Possible buffer overflow due to lack of buffer length check when segmented WMI command is received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-120
7.2
2021-10-20 CVE-2021-30288 Out-of-bounds Write vulnerability in Qualcomm products
Possible stack overflow due to improper length check of TLV while copying the TLV to a local stack variable in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-787
7.2
2021-06-09 CVE-2020-11235 Integer Overflow or Wraparound vulnerability in Qualcomm products
Buffer overflow might occur while parsing unified command due to lack of check of input data received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-190
7.2
2021-06-09 CVE-2020-11241 Out-of-bounds Read vulnerability in Qualcomm products
Out of bound read will happen if EAPOL Key length is less than expected while processing NAN shared key descriptor attribute in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
network
low complexity
qualcomm CWE-125
7.8