Vulnerabilities > Qualcomm > Qam8650P Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-10-03 | CVE-2023-33027 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing rsn ies. | 7.5 |
| 2023-10-03 | CVE-2023-33029 | Use After Free vulnerability in Qualcomm products Memory corruption in DSP Service during a remote call from HLOS to DSP. | 7.8 |
| 2023-10-03 | CVE-2023-33035 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption while invoking callback function of AFE from ADSP. | 7.8 |
| 2023-10-03 | CVE-2023-33039 | Use After Free vulnerability in Qualcomm products Memory corruption in Automotive Display while destroying the image handle created using connected display driver. | 7.8 |
| 2023-07-04 | CVE-2023-21672 | Use After Free vulnerability in Qualcomm products Memory corruption in Audio while running concurrent tunnel playback or during concurrent audio tunnel recording sessions. | 7.8 |
| 2023-07-04 | CVE-2023-22386 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in WLAN HOST while processing WLAN FW request to allocate memory. | 7.8 |
| 2023-07-04 | CVE-2023-22387 | Unspecified vulnerability in Qualcomm products Arbitrary memory overwrite when VM gets compromised in TX write leading to Memory Corruption. | 7.8 |
| 2023-07-04 | CVE-2023-24851 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in WLAN HOST while parsing QMI response message from firmware. | 7.8 |
| 2023-07-04 | CVE-2023-24854 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in WLAN HOST while parsing QMI WLAN Firmware response message. | 7.8 |
| 2023-06-06 | CVE-2022-33307 | Double Free vulnerability in Qualcomm products Memory Corruption due to double free in automotive when a bad HLOS address for one of the lists to be mapped is passed. | 7.8 |