Vulnerabilities > Qualcomm
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2018-10-26 | CVE-2017-18124 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products During secure boot, addition is performed on uint8 ptrs which led to overflow issue in Small Cell SoC, Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version FSM9055, IPQ4019, MDM9206, MDM9607, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDX20 | 7.2 |
| 2018-10-23 | CVE-2017-18313 | Unspecified vulnerability in Qualcomm products Under certain mode of operations, HLOS may be able get direct or indirect access through DXE channels to tamper with the authenticated WCNSS firmware stored in DDR because DXE-accessible memory is located within the authenticated image in Snapdragon Mobile and Snapdragon Wear in version MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617. | 5.7 |
| 2018-10-23 | CVE-2017-18312 | Missing Authorization vulnerability in Qualcomm products While accessing SafeSwitch services, third party can manipulate a given device and perform unauthorized operation due to lack of checking of same state transitions in Snapdragon Automobile, Snapdragon Mobile in version MSM8996AU, SD 410/12, SD 617, SD 650/52, SD 810, SD 820, SD 820A | 7.2 |
| 2018-10-23 | CVE-2017-18305 | Unspecified vulnerability in Qualcomm products XBL sec mem dump system call allows complete control of EL3 by unlocking all XPUs if enable fuse is not blown in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835. local qualcomm | 6.9 |
| 2018-10-23 | CVE-2017-18304 | Out-of-bounds Read vulnerability in multiple products Insufficient memory allocation in boot due to incorrect size being passed could result in out of bounds access in Small Cell SoC, Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in version FSM9055, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660 and SDX20 | 7.2 |
| 2018-10-23 | CVE-2017-18303 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products While processing the sensors registry configuration file, if inputs are not validated a buffer overflow will occur in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MMDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SDA660, SDX20. | 7.2 |
| 2018-10-23 | CVE-2017-18300 | Information Exposure vulnerability in Qualcomm products Secure display content could be accessed by third party trusted application after creating a fault in other trusted applications in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835, SDA660. | 4.9 |
| 2018-10-23 | CVE-2017-18299 | Resource Exhaustion vulnerability in Qualcomm products Improper translation table consolidation logic leads to resource exhaustion and QSEE error in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in version MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660 | 4.9 |
| 2018-10-23 | CVE-2017-18298 | NULL Pointer Dereference vulnerability in Qualcomm products Lack of Input Validation in SDMX API can lead to NULL pointer access in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660 . | 7.2 |
| 2018-10-23 | CVE-2017-18297 | Double Free vulnerability in Qualcomm products Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820. | 7.2 |