Vulnerabilities > Qualcomm > Msm8996Au > Medium
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2018-07-06 | CVE-2018-5892 | Information Exposure vulnerability in Qualcomm products The Touch Pal application can collect user behavior data without awareness by the user in Snapdragon Mobile and Snapdragon Wear. | 5.0 |
| 2018-07-06 | CVE-2018-5891 | Use After Free vulnerability in Qualcomm products While processing modem SSR after IMS is registered, the IMS data daemon is restarted but the ipc_dataHandle is no longer available. | 4.6 |
| 2018-07-06 | CVE-2018-5876 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products While parsing an mp4 file, a buffer overflow can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear. | 6.8 |
| 2018-07-06 | CVE-2018-5875 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products While parsing an mp4 file, an integer overflow leading to a buffer overflow can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear. | 6.8 |
| 2018-07-06 | CVE-2018-5874 | Out-of-bounds Write vulnerability in Qualcomm products While parsing an mp4 file, a stack-based buffer overflow can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear. | 6.8 |
| 2018-07-06 | CVE-2018-5838 | Improper Validation of Array Index vulnerability in Qualcomm products Improper Validation of Array Index In the adreno OpenGL driver in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear, an out-of-bounds access can occur in SurfaceFlinger. | 4.6 |
| 2018-07-06 | CVE-2018-11258 | Use After Free vulnerability in Qualcomm products In ADSP RPC in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear, a Use After Free condition can occur in versions MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20. | 4.6 |