Vulnerabilities > Qualcomm > Msm8996Au > Medium

DATE CVE VULNERABILITY TITLE RISK
2019-07-25 CVE-2019-2312 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
When handling the vendor command there exists a potential buffer overflow due to lack of input validation of data buffer received in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in MDM9607, MDM9640, MSM8996AU, QCA6174A, QCA6574AU, QCA9377, QCA9379, QCS405, QCS605, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 625, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM630, SDM660, SDX24
local
low complexity
qualcomm CWE-119
4.6
2019-07-25 CVE-2019-2306 Incorrect Type Conversion or Cast vulnerability in Qualcomm products
Improper casting of structure while handling the buffer leads to out of bound read in display in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS405, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20
local
low complexity
qualcomm CWE-704
4.6
2019-07-25 CVE-2019-2301 Out-of-bounds Read vulnerability in Qualcomm products
Possibility of out-of-bound read if id received from SPI is not in range of FIFO in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in IPQ4019, IPQ8064, MSM8909W, MSM8996AU, QCA9980, QCS605, Qualcomm 215, SD 425, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 712 / SD 710 / SD 670, SD 820A, SD 845 / SD 850, SD 855, SDM439, SDM660, SDX24
local
low complexity
qualcomm CWE-125
4.6
2019-07-25 CVE-2019-2299 Out-of-bounds Write vulnerability in Qualcomm products
An out-of-bound write can be triggered by a specially-crafted command supplied by a userspace application.
local
low complexity
qualcomm CWE-787
4.6
2019-07-25 CVE-2019-2290 Use After Free vulnerability in Qualcomm products
Multiple open and close from multiple threads will lead camera driver to access destroyed session data pointer in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCS605, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDM660, SDX20, SDX24, Snapdragon_High_Med_2016
local
low complexity
qualcomm CWE-416
4.6
2019-07-25 CVE-2019-2272 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
Buffer overflow can occur in display function due to lack of validation of header block size set by user.
local
low complexity
qualcomm CWE-119
4.6
2019-07-25 CVE-2019-2263 Use After Free vulnerability in Qualcomm products
Access to freed memory can happen while reading from diag driver due to use after free issue in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in IPQ4019, IPQ8064, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA9531, QCA9980, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDM660, SDX20, Snapdragon_High_Med_2016
local
low complexity
qualcomm CWE-416
4.6
2019-07-25 CVE-2019-2235 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
Buffer overflow occurs when emulated RPMB is used due to sector size assumptions in the TA rollback protection logic.
local
low complexity
qualcomm CWE-119
4.6
2019-07-25 CVE-2018-13897 Information Exposure vulnerability in Qualcomm products
Clients hostname gets added to DNS record on device which is running dnsmasq resulting in an information exposure in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables in MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCS605, SD 210/SD 212/SD 205, SD 615/16/SD 415, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 855, SDA660, SDM630, SDM660
network
low complexity
qualcomm CWE-200
5.0
2019-07-22 CVE-2019-2292 Out-of-bounds Write vulnerability in Qualcomm products
Out of bound access can occur due to buffer copy without checking size of input received from WLAN firmware in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in MDM9150, MDM9650, MSM8996AU, QCA6574AU, QCS405, QCS605, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 665, SD 712 / SD 710 / SD 670, SD 730, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM630, SDM660, SDX20, SDX24
local
low complexity
qualcomm CWE-787
4.6