Vulnerabilities > Qualcomm > Msm8996Au Firmware

DATE CVE VULNERABILITY TITLE RISK
2023-01-09 CVE-2022-25717 Double Free vulnerability in Qualcomm products
Memory corruption in display due to double free while allocating frame buffer memory
local
low complexity
qualcomm CWE-415
7.8
2023-01-09 CVE-2022-33218 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in Automotive due to improper input validation.
local
low complexity
qualcomm CWE-787
7.8
2023-01-09 CVE-2022-33219 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory corruption in Automotive due to integer overflow to buffer overflow while registering a new listener with shared buffer.
local
low complexity
qualcomm CWE-190
7.8
2023-01-09 CVE-2022-33266 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory corruption in Audio due to integer overflow to buffer overflow while music playback of clips like amr,evrc,qcelp with modified content.
local
low complexity
qualcomm CWE-190
7.8
2023-01-09 CVE-2022-33285 Out-of-bounds Read vulnerability in Qualcomm products
Transient DOS due to buffer over-read in WLAN while parsing WLAN CSA action frames.
low complexity
qualcomm CWE-125
6.5
2023-01-09 CVE-2022-33286 Out-of-bounds Read vulnerability in Qualcomm products
Transient DOS due to buffer over-read in WLAN while processing 802.11 management frames.
low complexity
qualcomm CWE-125
6.5
2023-01-09 CVE-2022-33290 NULL Pointer Dereference vulnerability in Qualcomm products
Transient DOS in Bluetooth HOST due to null pointer dereference when a mismatched argument is passed.
network
low complexity
qualcomm CWE-476
7.5
2023-01-09 CVE-2022-33299 NULL Pointer Dereference vulnerability in Qualcomm products
Transient DOS due to null pointer dereference in Bluetooth HOST while receiving an attribute protocol PDU with zero length data.
network
low complexity
qualcomm CWE-476
7.5
2023-01-09 CVE-2022-40520 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption due to stack-based buffer overflow in Core
local
low complexity
qualcomm CWE-787
7.8
2022-12-13 CVE-2022-25677 Use After Free vulnerability in Qualcomm products
Memory corruption in diag due to use after free while processing dci packet in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-416
7.8