Vulnerabilities > Qualcomm > Msm8996Au Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2019-05-24 | CVE-2018-11930 | Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products Improper input validation on input data which is used to locate and copy the additional IEs in WLAN function can lead to potential integer truncation issue in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCS605, Qualcomm 215, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 675, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24, SM7150 | 10.0 |
| 2019-05-24 | CVE-2018-11928 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Lack of check on length parameter may cause buffer overflow while processing WMI commands in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in IPQ8074, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6174A, QCA6564, QCA6574, QCA6574AU, QCA6584, QCA6584AU, QCA8081, QCA9377, QCA9379, QCA9886, QCS605, SD 210/SD 212/SD 205, SD 425, SD 600, SD 625, SD 636, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM630, SDM660, SDX20, SDX24, SM7150, SXR1130 | 7.2 |
| 2019-05-24 | CVE-2018-11927 | Improper Validation of Array Index vulnerability in Qualcomm products Improper input validation on input which is used as an array index will lead to an out of bounds issue while processing AP find event from firmware in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6174A, QCA6574AU, QCA9377, QCA9379, SD 210/SD 212/SD 205, SD 625, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 845 / SD 850, SD 855, SDX20, SDX24, SM7150 | 7.2 |
| 2019-05-24 | CVE-2018-11924 | Integer Overflow or Wraparound vulnerability in Qualcomm products Improper buffer length validation in WLAN function can lead to a potential integer oveflow issue in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6174A, QCA6574AU, QCA9377, QCA9379, QCS605, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM630, SDM660, SDX20, SDX24, SM7150 | 4.6 |
| 2019-05-24 | CVE-2018-11923 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Improper buffer length check before copying can lead to integer overflow and then a buffer overflow in WMA event handler in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, QCS605, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM630, SDM660, SDX20, SDX24 | 4.6 |
| 2019-05-24 | CVE-2018-11271 | Improper Authentication vulnerability in Qualcomm products Improper authentication can happen on Remote command handling due to inappropriate handling of events in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SM7150, Snapdragon_High_Med_2016, SXR1130 | 7.5 |
| 2019-05-06 | CVE-2017-18279 | Integer Overflow or Wraparound vulnerability in Qualcomm products Lack of check of buffer length before copying can lead to buffer overflow in camera module in Small Cell SoC, Snapdragon Mobile, Snapdragon Wear in FSM9055, FSM9955, IPQ4019, IPQ8064, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA9531, QCA9558, QCA9563, QCA9880, QCA9886, QCA9980, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016. | 7.2 |
| 2019-05-06 | CVE-2017-18157 | Use After Free vulnerability in Qualcomm products A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20. | 7.2 |
| 2019-05-06 | CVE-2017-18156 | Use After Free vulnerability in Qualcomm products While processing camera buffers in camera driver, a use after free condition can occur in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 625, SD 820, SD 820A, SD 835, SDX20. | 7.2 |
| 2019-05-06 | CVE-2017-18131 | Improper Initialization vulnerability in Qualcomm products In QTEE, an incorrect fuse value can be blown in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 820, SD 820A, SD 835, SD 845, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016. | 7.2 |