Vulnerabilities > Qualcomm > Msm8940 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-06-09 | CVE-2020-11176 | Out-of-bounds Write vulnerability in Qualcomm products While processing server certificate from IPSec server, certificate validation for subject alternative name API can cause heap overflow which can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile | 9.8 |
| 2021-06-09 | CVE-2020-11291 | Improper Validation of Array Index vulnerability in Qualcomm products Possible buffer overflow while updating ikev2 parameters for delete payloads received during informational exchange due to lack of check of input validation for certain parameters received from the ePDG server in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile | 9.8 |
| 2021-06-09 | CVE-2020-11292 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow in voice service due to lack of input validation of parameters in QMI Voice API in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2021-06-09 | CVE-2020-11239 | Use After Free vulnerability in Qualcomm products Use after free issue when importing a DMA buffer by using the CPU address of the buffer due to attachment is not cleaned up properly in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2021-06-09 | CVE-2020-11261 | Improper Input Validation vulnerability in Qualcomm products Memory corruption due to improper check to return error when user application requests memory allocation of a huge size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2021-05-07 | CVE-2020-11279 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption while processing crafted SDES packets due to improper length check in sdes packets recieved in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 9.8 |
| 2021-05-07 | CVE-2020-11285 | Out-of-bounds Read vulnerability in Qualcomm products Buffer over-read while unpacking the RTCP packet we may read extra byte if wrong length is provided in RTCP packets in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 9.1 |
| 2021-05-07 | CVE-2020-11289 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Out of bound write can occur in TZ command handler due to lack of validation of command ID in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-05-07 | CVE-2020-11293 | Out-of-bounds Read vulnerability in Qualcomm products Out of bound read can happen in Widevine TA while copying data to buffer from user data due to lack of check of buffer length received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.0 |
| 2021-04-07 | CVE-2020-11255 | Memory Leak vulnerability in Qualcomm products Denial of service while processing RTCP packets containing multiple SDES reports due to memory for last SDES packet is freed and rest of the memory is leaked in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables | 7.5 |