Vulnerabilities > Qualcomm > Msm8937 Firmware > Critical
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-09-08 | CVE-2021-1920 | Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products Integer underflow can occur due to improper handling of incoming RTCP packets in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 9.8 |
| 2021-09-08 | CVE-2021-1919 | Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products Integer underflow can occur when the RTCP length is lesser than than the actual blocks present in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 9.8 |
| 2021-09-08 | CVE-2021-1916 | Out-of-bounds Write vulnerability in Qualcomm products Possible buffer underflow due to lack of check for negative indices values when processing user provided input in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 9.8 |
| 2021-07-13 | CVE-2020-11307 | Improper Validation of Array Index vulnerability in Qualcomm products Buffer overflow in modem due to improper array index check before copying into it in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 9.8 |
| 2021-05-07 | CVE-2020-11285 | Out-of-bounds Read vulnerability in Qualcomm products Buffer over-read while unpacking the RTCP packet we may read extra byte if wrong length is provided in RTCP packets in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 9.1 |
| 2021-05-07 | CVE-2020-11279 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption while processing crafted SDES packets due to improper length check in sdes packets recieved in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 9.8 |
| 2021-04-07 | CVE-2020-11191 | Out-of-bounds Read vulnerability in Qualcomm products Out of bound read occurs while processing crafted SDP due to lack of check of null string in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 9.1 |
| 2021-04-07 | CVE-2020-11247 | Out-of-bounds Read vulnerability in Qualcomm products Out of bound memory read while unpacking data due to lack of offset length check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 9.1 |
| 2021-04-07 | CVE-2020-11251 | Out-of-bounds Read vulnerability in Qualcomm products Out-of-bounds read vulnerability while accessing DTMF payload due to lack of check of buffer length before copying in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 9.1 |
| 2021-03-17 | CVE-2020-11166 | Out-of-bounds Read vulnerability in Qualcomm products Potential out of bound read exception when UE receives unusually large number of padding octets in the beginning of ROHC header in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 9.1 |