Vulnerabilities > Qualcomm > Msm8917 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-09-09 | CVE-2021-1933 | Improper Validation of Array Index vulnerability in Qualcomm products UE assertion is possible due to improper validation of invite message with SDP body in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 9.8 |
| 2021-09-09 | CVE-2021-1934 | Double Free vulnerability in Qualcomm products Possible memory corruption due to improper check when application loader object is explicitly destructed while application is unloading in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT | 7.8 |
| 2021-09-09 | CVE-2021-1935 | NULL Pointer Dereference vulnerability in Qualcomm products Possible null pointer dereference due to lack of validation check for passed pointer during key import in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 5.5 |
| 2021-09-09 | CVE-2021-1946 | NULL Pointer Dereference vulnerability in Qualcomm products Null Pointer Dereference may occur due to improper validation while processing crafted SDP body in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 9.8 |
| 2021-09-09 | CVE-2021-30295 | Classic Buffer Overflow vulnerability in Qualcomm products Possible heap overflow due to improper validation of local variable while storing current task information locally in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.8 |
| 2021-09-08 | CVE-2021-1904 | Incorrect Comparison vulnerability in Qualcomm products Child process can leak information from parent process due to numeric pids are getting compared and these pid can be reused in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 5.5 |
| 2021-09-08 | CVE-2021-1914 | Infinite Loop vulnerability in Qualcomm products Loop with unreachable exit condition may occur due to improper handling of unsupported input in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 7.5 |
| 2021-09-08 | CVE-2021-1916 | Out-of-bounds Write vulnerability in Qualcomm products Possible buffer underflow due to lack of check for negative indices values when processing user provided input in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 9.8 |
| 2021-09-08 | CVE-2021-1919 | Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products Integer underflow can occur when the RTCP length is lesser than than the actual blocks present in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 9.8 |
| 2021-09-08 | CVE-2021-1920 | Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products Integer underflow can occur due to improper handling of incoming RTCP packets in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 9.8 |