Vulnerabilities > Qualcomm > Msm8909W Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2018-04-11 | CVE-2017-18140 | Use After Free vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, when processing a call disconnection, there is an attempt to print the RIL token-id to the debug log. | 10.0 |
| 2018-04-11 | CVE-2017-18139 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, a buffer overflow vulnerability may potentially exist while making an IMS call. | 10.0 |
| 2018-04-11 | CVE-2017-18138 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, in GERAN, a buffer overflow may potentially occur. | 10.0 |
| 2018-04-11 | CVE-2017-18136 | Use After Free vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 820, SD 820A, SD 835, SD 845, in the omx aac component, a Use After Free condition may potentially occur. | 10.0 |
| 2018-04-11 | CVE-2017-18127 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 835, SD 845, while processing a SetParam command packet in the VR service, the extracted name_len and value_len values are not checked and could potentially cause a buffer overflow in subsequent calls to memcpy(). | 10.0 |
| 2018-04-11 | CVE-2017-18074 | Improper Input Validation vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9607, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 615/16/SD 415, SD 800, SD 808, SD 810, SD 820, SD 835, while playing a .wma file with modified media header with non-standard bytes per second parameter value, a reachable assert occurs. | 10.0 |
| 2018-04-11 | CVE-2017-18071 | Unspecified vulnerability in Qualcomm products In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, debug policy can potentially be bypassed. | 10.0 |
| 2018-03-30 | CVE-2017-14912 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products In Android before 2018-01-05 on Qualcomm Snapdragon IoT, Snapdragon Mobile [VERSION]: MDM9206, MDM9607, MDM9650, MSM8909W, SD 200, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 835, the attributes of buffers in Secure Display were not marked properly. | 10.0 |
| 2018-03-15 | CVE-2017-17773 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products In Snapdragon Automobile, Snapdragon Wearable and Snapdragon Mobile MDM9206,MDM9607,MDM9650,SD 210/SD 212/SD 205,SD 400,SD 410/12,SD 425,SD 430,SD 450,SD 600,SD 602A,SD 615/16/SD 415,SD 617,SD 625,SD 650/52,SD 800,SD 808,SD 810,SD 820,SD 820Am,SD 835,SD 845,MSM8909W, improper input validation in video_fmt_mp4r_process_atom_avc1() causes a potential buffer overflow. | 10.0 |